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Hot Chips 22

General Information

HOT CHIPS 22 (2010)
Date August 22-24, 2010
Place Memorial Auditorium, Stanford University
Committees HC 21 Committees and Sponsors

Tutorials

TutorialsSunday, August 22, 2010
Introductions Aurangzeb Khan (Citius Consulting) and Dan Lenoski (CISCO)

Morning Tutorial

Part 1:
Morning Tutorial Part 1

Part 2:
Morning Tutorial Part 2

  • Managing the Evolution of Flash: beyond Memory to Storage
    Tony Kim Director, Technical Marketing Mobile/Flash Solution Team Lead Samsung Semiconductor, Inc.
  • Forging a Future in Memory - NewTechnologies, New Markets, New Applications
    Ed Doller V.P. & Chief Memory Systems Architect
    Corporate Vice President
    Micron Technology, Inc.
  • Status and Prospect for MRAM Technology
    Dr. Saied Tehrani, Chief Operating Officer
    Everspin Technologies, Inc.
  • Metal Oxide RRAM as a Future Non-Volatile Memory Technology
    Dr. Paul Kirsch SEMATECH
  • The Inevitable Rise of Nonvolatile Memory in Computing
    Jim Handy Founder/President Objective Analysis
  • Storage Class Memory: Technology, Systems and Applications
    Dr. Richard Freitas, IBM Almaden Research Center

Afternoon Tutorial

Part 1:
Afternoon Tutorial Part 1

Part 2:
Afternoon Tutorial Part 2

Optical Interconnect

Chairs: Ron Ho (Oracle) and Rick Hetherington (Oracle)

  • Introduction
  • Overview of silicon photonic technologies, from VCSELs to silicon nanophotonics
    Dr. Ashok Krishnamoorthy, Oracle.
  • Case study #1: Silicon photonics in the data center
    Professor Al Davis, Utah/HP Labs.
  • Case study #2: Silicon photonics and memories
    Professor Vladimir Stojanovic, MIT.
  • Case study #3: Hybrid on-chip data networks
    Gil Hendry, Columbia University.
  • Case study #4: Some design considerations
    Frankie Liu, PhD, VLSI Research Group, Sun Labs, Oracle.

Conference Day One

SessionMonday, August 23, 2010

Intro/Opening Remarks

Session 1

HC 22 Session 1

Session 1: High Performance Computing (Session chair: Bill Lynch, Huawei)

  • Fermi GF100, A Graphics Processing Unit (GPU) Architecture For Compute, Tessellation, Physics, And Computational Graphics
    Authors: Craig Wittenbrink, Emmett Kilgariff and Arjun Prabhu
    Affiliations: NVIDIA
  • Surviving the End of Scaling of Traditional Microprocessors in HPC
    Authors: Olav Lindtjorn, Robert G. Clapp, Oliver Pell, Oskar Mencer and Michael J. Flynn
    Affiliations: Schlumberger, Stanford
  • Harnessing the Adaptive Energy Management Features of the POWER7 chip
    Authors: Michael Floyd, Bishop Brock, Malcolm Ware, Karthick Rajamani, Alan Drake, Charles Lefurgy and Lorena Pesantez
    Affiliations: IBM

Keynote 1


Morning Tutorial Part 2

Keynote 1: Searches originating Inside and Outside of your Head (Augmented Reality and Visual Search)

Speaker : Dr David Petrou, Google

Session 2

HC 22 Session 2

Session 2: SoCS (Session Chair: Christos Kozyrakis, Stanford)

  • The New Xbox 360 SoC
    Authors: Rune Jensen
    Affiliations: Microsoft Corporation
  • Extensions to the ARMv7-A Architecture
    Authors: David Brash
    Affiliations: ARM
  • Transcede™: Solving 4G Challenges for Pico, Micro and Macrocell Platforms
    Authors: Jim Johnston, CTO, Communications Convergence Processing, Mindspeed Technolgies, Inc.
    Affiliations: Mindspeed Technologies Inc.
  • GreenDroid: A Mobile Application Processor for a Future of Dark Silicon
    Authors: Nathan Goulding, Jack Sampson, Ganesh Venkatesh, Saturnino Garcia, Joe Auricchio, Jonathan Babb, Michael Taylor and Steven Swanson
    Affiliations: University of California, San Diego and Massachusetts Institute of Technology

Session 3

HC 22 Session 3

Session 3: Networking & Data Center (Session Chair: Krste Asanovic, UC Berkeley)

  • The IBM PowerEN™ Processor: 16 Power™ Cores With Hardware Acceleration
    Authors: Jeffrey Brown Charlie Johnson
    Affiliations: IBM
  • Smart Memory for High Performance Network Packet Forwarding
    Authors: Bill Lynch and Sailesh Kumar
    Affiliations: Huawei Technologies, USA
  • Demonstration of a High Speed 4-Channel Integrated Silicon Photonics WDM Link With Hybrid Silicon Lasers
    Speaker: Andrew Alduino
    Affiliations: Intel

Panel Discussion

HC 22 Panel Discussion

Panel Discussion (Chair: Forest Baskett, NEA)

Asia: Partner or competitor?

Chair: Forest Baskett, , General Partner, New Enterprise Associates

Panelists:

  • Craig Barratt, President & CEO, Atheros Communications, Inc.
  • Leo Li, President & CEO, Spreadtrum Communications Inc.
  • Tom Malloy, SVP & Chief Software Architect, Advanced Technology Labs, Adobe Systems Inc.
  • Ford Tamer, CEO, Telegent Systems, Inc.

Conference Day Two

SessionTuesday, August 24, 2010

Session 4

HC 22 Session 4

Session 4: FPGAs (Session Chair: Pradeep Dubey, Intel)

  • Xilinx 28nm generation programmable families
    Authors: Brad Taylor, Rick Crotty, Greg Starr and Ralph Wittig
    Affiliations: Xilinx
  • Stratix V with 28Gbps Transceivers in 28nm
    Authors: Dan Mansur
    Affiliations: Altera
  • 3D FPGA for Improved Density, Power and Performance
    Speaker: Raminda Madurawe
    Affiliations: Tier Logic

Session 5

HC 22 Session 6

Session 5: Interconnects (Session chair: Bill Dally, Stanford/NVIDIA)

  • Silicon Photonics: Optical Connectivity at 25 Gbps and Beyond
    Authors: Brian Welch
    Affiliations: Luxtera
  • ICC: An interconnect controller for the Tofu interconnect architecture 
    Authors: Takashi Toyoshima
    Affiliations: Fujitsu Limited
  • The IBM Hub Module in 45nm CMOS SOI: A Terabyte Interconnect Switch for High-Performance Computer Systems
    Authors: Scott Clark, Baba Arimilli, Ben Drerup, Jerry Lewis, John Irish, David Krolak, Kerry Imming, Joe McDonald and Andreas Koenig, Daniel Dreps, David Siljenberg, Steve Baumgartner, Glen Wiedemeier, Jim Strom, Dan OConnor, Andrew Maki, Dhaval Sejpal, Mark Ritter, Dave Friend and Charlie Geer
    Affiliations: IBM
  • Spidergon STNoC: the technology that gives an added value to your System
    Authors: Marcello Coppola
    Affiliations: STMicroelectronics

Keynote 2


Morning Tutorial Part 2

Keynote 2: Looking at Transportation in New Ways

What does mobility look like in the future?

Burkhard Huhnke, VWGoA, Electronics Research Lab, Palo Alto, CA

Session 6

HC 22 Session 6

Session 6: Servers (Session Chair: Alan Smith, UC Berkeley)

  • Westmere-EX: A 20 Thread Server CPU
    Authors: Dheemanth Nagaraj and Sailesh Kottapalli
    Affiliations: Intel
  • Architectural Innovations in WSM-EP
    Authors: Muntaquim Chowdhury, Derek Bachand, Dave Hill, Erik Hallnor, Barry Huntley, Brent Boswell and Rajesh Parthasarathy
    Affiliations: Intel
  • GS464V: A High-Performance Low-Power XPU with 512-Bit Vector Extension
    Authors: Weiwu Hu and Yunji Chen
    Affiliations: Institute of Computing Technology, Chinese Academy of Sciences

Session 7

HC 22 Session 7

Session 7: New Processor Architectures (Session Chair: Bevan Baas, UC Davis)

  • The Next-generation System z Micro-Processor
    Authors: Brian Curran
    Affiliations: IBM
  • AMD "Bulldozer" Core - a new approach to multithreaded compute performance for maximum efficiency and throughput
    Authors: Mike Butler
    Affiliations: AMD
  • AMD's "Bobcat" x86 Core - Small, Efficient and Strong
    Authors: Brad Burgess
    Affiliations: AMD

Closing Remarks


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