Hot Chips 13, A Symposium on High-Performance Chips at Stanford University August 19-21, 2001

 Advance Program

Hot Chips 13 brings together designers and architects of high-performance chips, software, and systems. Presentations focus on up-to-the-minute real developments. This symposium is the primary forum for engineers and researchers to highlight their leading-edge designs. Three full days of tutorials and technical sessions will keep you on top of the industry. The symposium will be held at the Memorial Auditorium, Stanford University, Palo Alto, California.

 Sunday, August 19
8:30-12:00 Morning Tutorial Jan Rabaey UC Berkeley
  • Silicon Platforms for the Next-Generation Wireless Systems
1:30-5:00 Afternoon Tutorial Rob A. Rutenbar
Ramesh Harjani
Carnegie Mellon/Neolinear
Univ. of Minnesota
12:00-1:300 Lunch
  • Design at the Leading Edge of Mixed-Signal ICs

Organizing Committee

Chair  
Lily Jow Compaq
Finance  
Angela Lee Compaq
Publicity  
Cary Kornfeld Kdesign
Vojin Oklobdzija UC Davis
Advertising  
Allen Baum Intel
Publications  
Linda McAllister
David Moberly Agilent
Registration  
Joe Fitzgerald  
Bala Joshi Intel
Alice Young  
Local Arrangements
Amr Zaky ARC Cores
Bob Lashley Sun
Yusuf Abdulghani Apple
Webmaster  
Ann Zeise Gomilpitas.com
At Large  
Martin Freeman Philips Research
Slava Mach SCVCS Chair
Howard Sachs HGS Engineering
Gail Sachs HGS Engineering
Alan Jay Smith UC Berkeley
Bob Stewart SRE
Kimming So Broadcom
Program Committee
Program Co-Chairs
John Kubiatowicz UC Berkeley
Andy Wolfe SONIC|blue
Program Committee
Forest Baskett NEA
Bill Dally Stanford
Keith Diefendorff ARC Cores
Norm Jouppi Compaq
Jim Keller Broadcom
Chuck Moore Chicory Systems
Jan Rabaey UC Berkeley
Howard Sachs HGS Engineering
Mitsuo Saito Toshiba
John Shen Intel
Alan Jay Smith UC Berkeley
George Taylor  
Marc Tremblay Sun
John Wawrzynek UC Berkeley
 Monday, August 20
Microprocessors I Chair: Chuck Moore
  • R18000, The latest SGI Superscalar Microprocessor
Silicon Graphics
  • The ARM10 Family of Embedded Advanced Cores
ARM, Inc.
  • Power4 System Design for High Reliability
IBM
Embedded Solutions Chair: Andrew Wolfe
  • Rapid Application Optimization Using Configurable Processor Extensions
Tensilica
  • SH-5: A First 64-bit SuperH Core with Multimedia Extension
Hitachi
  • Gekko: A PowerPC compatible processor supporting high-performance 3D graphics
IBM
Keynote Atiq Raza Raza Foundries

Silicon for a 10 Gigabit-per-second connected world

Integrated Communications and Networking Chair: Forest Baskett
  • A Mobile Station Modem Chip for WCDMA
Qualcomm
  • nFlex, A Broadband Wireless Communications Processor
nBand Communications
  • Mellanox InfiniBridge: An Integrated InfiniBand Switch/Channel Adapter
Mellanox Technologies
High Speed Communications Chair: Jan Rabaey
  • A 2.5Tb/s switch core with LCS interface
PMC-Sierra
  • A 5 GB/s backplane transceiver enabling multi-terabit backplane connectivity
Accelerant Networks
  • A Single-Chip Terabit Switch
Velio Communications
Panel Moderator: Linley Gwennap The Linley Group

My network processor is better than your network processor!

 Tuesday, August 21
Network Switch Technology Chair: John Wawrzynek
  • Payload+: Fast pattern matching and routing for OC-48
Agere Systems
  • Fabr-IC: Single-Chip Gigabit Ethernet Switch w/ Integrated Memory
MOSAID
  • Ultra high performance network memory
Alpine Microsystems
  • Tyrant: A High Performance Storage over IP Switch Engine
Nishan Systems
Storage Chair: Howard Sachs
  • 1.8-inch Super Small Slim HDD
Toshiba
  • Microdrive: High Capacity Storage for the Handheld Revolution
IBM
  • DataPlay, a New Technology for Information Distribution
DataPlay Inc.
Keynote Mark Dean

IBM Fellow & VP of Systems Research

Trends Impacting Computing Systems Design and the IT Industry

Chip Multiprocessors Chair: John Kubiatowicz
  • 53 GOPS Programmable Vision Processor For Processing, Coding-Decoding and Synthesizing of Images
Infineon
  • A MIMD-based Multi Threaded Processor
Kirchhoff Institute for Physics
  • The Raw Processor: A Composeable 32-Bit Fabric for Embedded and General Purpose Computing
MIT
Microprocessors II Chair: John Shen
  • Itanium Performance Insights from the IMPACT Compiler
Univ. of Illinois
  • The Intel 870 Family of Enterprise Chipsets
Intel
  • The Pentium® 4 Processor
Intel
 

This is a preliminary program; changes may occur. Registration will begin here after June 6th. For the most up-to-the-minute details on presentations and schedules, and for information on registration, please check this web site.

For answers to registration questions, email hotchips2001@hotmail.com.
IEEE LogoFor answers to general questions, email info@hotchips.org
Please send any web page comments to webmaster@hotchips.org

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Sponsored by the Technical Committee on Microprocessors and Microcomputers of the IEEE Computer Society