Hot Chips 14 brings together designers and architects of high-performance chips, software, and systems. Presentations focus on up-to-the-minute real developments. This symposium is the primary forum for engineers and researchers to highlight their leading-edge designs. Three full days of tutorials and technical sessions will keep you on top of the industry.

Sunday, August 18

Morning Tutorial
IC Technology Scaling Trends, Challenges, & Potential Solutions through 2016
Peter M. Zeitzoff, Int'l SEMATECH Senior Fellow (MOSFETs)
Tony Yen, Co-Director, Lithography Div., Int'l SEMATECH (Lithography)

In this tutorial, three major areas of IC technology are addressed: MOSFET devices and front-end process integration, interconnect, and lithography. For each area, the scaling projections are discussed, key issues and challenges are assessed, and potential solutions for the challenges are evaluated, all through the year 2016.

Afternoon Tutorial
Low Power Wireless Networked System Design
Rajesh K. Gupta
Center for Embedded Computer Systems, UC Irvine

This tutorial concerns the design of integrated systems with network connections incorporating an RF front end, baseband DSP, link layer coding and medium access control functions. A major challenge in the design of these systems is meeting the system performance with the lowest area, cost, and power. The tutorial focuses on top-down design approaches and techniques that help to bridge the gap between the system engineering and integrated circuits implementation that has limited the degree of optimization one could do from the system level down to circuit level implementation.

Monday, August 19

Intel Microprocessors
• Intel McKinley Intel/HP
• An Analysis of the CPU2K Benchmarks on the McKinley Processor, Intel/HP
• Intel Xeon Processor and Hyper-Threading Technology, Intel

Keynote: Eric Schmidt CTO, Google
• TBA

Network Processors
• Benchmark Performance of the IBM PowerNP NP4GS3 Network Processor, IBM
• AMCC's 2nd Generation 5Gbps Network Processor, Applied Micro Circuits

Interconnect
• A 20Gb/s 0.13um CMOS Serial Link, Stanford
• Smarter Interconnects for Smarter Chips, Sonics
• Building High Performance Multi-processor Systems with JIO, Sun

Technology
• Integrated Cryptographic Hardware Engines on the zSeries Microprocessor, IBM
• How a processor can permute n bits in O(1) cycles, Princeton University
• Thoughtbeam Technology, Motorola Systems on Chip I
• The RM9000 Family of Integrated Multiprocessor Devices, PMC-Sierra
• Alchemy Au1X100, AMD

Evening Panel Discussion:
Embedded Systems Software : Visions of the Future, John Mashey


Tuesday, August 20

Potpourri
• The Atheros Chipset for 108 Mb/s Multi-Mode Wireless LANs, Atheros
• PipeRench, CMU
• GeForce4, Nvidia

Keynote: Tom Edwards, NASA
• Air Traffic Control

Digital Signal Processing
• A New Distributed DSP Architecture Based on the Intel IXS, Intel
• VASA, NTT

Switches
• Delivering On The Promise of Asynchronous Circuit Design, Fulcrum
• A Multi-Terabit Scalable Switch Fabric: Architecture and Challenges, IBM
• CMOS Crossbar, HKU

Systems on Chip II
• FirePath, Broadcom
• Calisto, Broadcom
• BCM1101 Ethernet Enterprise IP Phone Platform, Broadcom

AMD Hammer
• The AMD x86-64 ISA: Extending the x86 to 64-bits, AMD
• The AMD Hammer Processor Core, AMD
• Hammer Shared Memory Multi Processor Systems, AMD