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Since it began
in 1989, Hot Chips has been known as one of the semiconductor industry's
leading conferences on high-performance microprocessors and related
integrated circuits. The conference is held once a year in August
on the Stanford University campus in the center the world's capital
of electronics activity, Silicon Valley. The emphasis this year,
as in of previous years, is on real products and realizable technology.
Topics of interest for this year's conference include:
·
High-performance microprocessors
· Single-chip multiprocessors
· Embedded processors
· Low-power chips
· Systems-on-chip
· Performance evaluation
· Novel compiler technology
· Special-function processors:
DSP, multimedia, network
· Special-function chips: graphics, security, communications
· Binary translation
· Operating system/chip interaction
· Nano and quantum computing
· Integrated MEMS devices
· Advanced semiconductor process technology
Presentations at Hot Chips are in the form of 30-minute talks. Presentation
slides will be published in the Hot Chips Proceedings. Participants
are not required to submit written papers, but a select group will
be invited to submit a paper for inclusion in a special issue of
IEEE Micro. Submissions must consist of a title, abstract (three
pages maximum), and the presenter's contact information (name, affiliation,
job title, address, phone, fax, and email). Please indicate whether
you have submitted or intend to submit a similar submission to another
conference or journal. Also indicate if you would like the submission
to be held confidential until the conference; we will do our best
to maintain confidentiality. Submissions are evaluated by the Program
Committee on the basis of the performance of the device, degree
of innovation, use of advanced technology, and potential market
significance. Authors will be notified of the status of their submission
by the end of April, 2002. Don't miss this chance to present your
device to an audience of the leading technologists in the world
of semiconductors. Submissions must be received no later than March
15, 2002. Please make your submissions in Adobe Acrobat PDF format
by email to: hotchips@eecs.berkeley.edu
Send
questions to hotchips@eecs.berkeley.edu
or contact
Program Committee Co-Chairs
Prof. John Wawrzynek, Univ. of California, Berkeley
(510) 643-9434
Keith Diefendorff, MIPS Technologies
(650) 567-5188
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