Hot Chips In The News
Dual-core chips bring dual caches
Michael Kanellos, CNET News.com, August 25
A version of Opteron coming in 2005 and Montecito, a future member of Intel's Itanium family also slated for next year, will both have two processor cores, the actual unit inside a processor that performs the calculations, and each core will have separate caches, pools of memory integrated into the chip for rapid data access, according to company presentations at the Hot Chips conference at Stanford University.
Outsourcing Debate Rages On
Mark Hachman, August 23, eWeek
A conference of the meritoriously employed debated the benefits and pitfalls of outsourcing Monday night, largely concluding that the trend toward shipping jobs abroad was inevitable.
Sony presents CCU for PSP
G-NewZ Weblog, August 24 (In German)
Auf dem Halbleiterkongress Hotchips an der Stanford-Universität in Kalifornien enthüllte Sony heute erstmals Details zur Chip-Plattform des PSP (Playstation Portable). Für die mobile Spielkonsole hat Sony insgesamt 3 Prozessoreinheiten mit 4 MB Embedded-DRAM (eDRAM) in einem Baustein kombiniert. Die CPU besteht aus einem 32-bit R4000-Kern von Mips sowie je einer Gleitkomma- und Vektoreinheit. Von diesem Mips-Kern gesteuert sorgt eine 3D-Grafik-Engine, ausgestattet mit 2 MB eDRAM als Videospeicher, für die Spielverarbeitung. Die Spiele sollen auf einem 4,3-Zoll-Display (16:9-Format) in einer Auflösung von 480-272 Punkten dargestellt werden.
Translation:
Today for the first time, Sony revealed the details of the chip platform for the PSP (Playstation Portable) at the semiconductor conference, Hotchips at Stanford University in California. Sony has a total of 3 processor units with 4 embedded-DRAM (eDRAM) combined in a [building block]. The CPU consists of a 32-bit Mips R4000 kernel that performs both floating point and vector computations. The Mips kernel steers a 3D grafics engine, which is configured with 2 MB eDRAM video playback for [play processing]. Games are displayed on a 4.3 inch (16:9 format) at a resolution of 480x272 pixels.
CPU, Multimedia, And Wireless ICs take Center Stage at Hot Chips
July 19, Electronic Design
Top companies will reveal their latest advances in portable systems, high-performance graphics, and advanced desktops at the 16th Hot Chips conference at Standford University, August 23-24. Presentations will divulge new architectural approaches as they deliver leading-edge performance.
Hot Chips conference plans eclectic program
June 21, EETimes
From Mars to the nanoscale, the Hot Chips 16 conference to be held at Stanford University August 22-24, will span perhaps the widest range of high-end chip design topics this annual event has ever offered. Once the place to get the scoop on desktop and server CPUs, Hot Chips now reflects the dethroning of devices that once dominated the thinking and drove the technology of high-end designs at this year's conference range from deep-space applications to chips for mobile systems and the growing dominance of consumer electronics.
Sun Offers Glimpse of Niagara
Infoworld, June 17
Engineers from Sun Microsystems Inc., will reveal the first technical details on the company's eight-core microprocessor, code-named Niagara, at the Hot Chips symposium on high-performance processors being held this August at Stanford University in Palo Alto, according to an abstract of their discussion submitted to the Hot Chips show organizers.