HOT CHIPS 16 Final Program
HOT CHIPS 16 brings together designers and architects of high-performance chips, software, and systems. Presentations focus on up-to-the-minute real developments. This symposium is the primary forum for engineers and researchers to highlight their leading-edge designs. Three full days of tutorials and technical sessions will keep you on top of the industry.
| HOT CHIPS 16 Final Program | ||
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| Sunday, August 22nd | ||
| 8:30-12:00 | Morning Tutorial |
Chair: Tom Petersen (MIPS Technologies) |
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Ultrawideband; Technology and Issues Speakers: Roberto Aiello (Staccato Communications), Anuj Batra (Texas Instruments), Nathan Belk (Texas Instruments), Sandeep Kumar (Adimos) |
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This tutorial delves into the major issues surrounding the emerging UWB environment. We discuss some of the fundamental technology issues of this PHY in both the analog and digital domains. This topic is elaborated using real world designs to consider the key system level issues that manifest in UWB based designs. We follow the technology discussions with target market descriptions and explore the opportunities that UWB technologies enable. Our discussions are hosted by the drivers behind UWB, system architects and chip implementers. They describe and discuss the tradeoffs that they faced during their development of the UWB specs and the initial implementations. Biographies Dr. Aiello is founder and CEO of Staccato Communications, Inc. He is a recognized leader in the ultrawideband (UWB) community and is actively involved in standardssetting committees. Dr. Aiello is a founding member of both the IEEE 802.15.3a and the 802.15.4a Groups and of the Multiband OFDM Alliance. Dr. Aiello holds a Ph.D. degree in physics from the University of Trieste. He has authored more than 20 patents on UWB technology. Anuj Batra is currently a Member, Group Technical Staff at TI and his research interests are in the areas of wireless communications, in particular, the design of high-speed wireless networks, multi-user detection theory, and coexistence between unlicensed wireless devices. Since joining TI, he has also been involved in standardization activities for MBOA SIG, IEEE 802.15.3a, IEEE 802.11g, IEEE 802.15.2 and Bluetooth SIG. Dr. Batra received the B.S. degree, with distinction, in electrical engineering from Cornell University, Ithaca, NY, in 1992; the M.S. degree in electrical engineering from Stanford University, Stanford, CA, in 1993; and the Ph.D. degree in electrical engineering from Georgia Institute of Technology, Atlanta, in 2000. Nathan Belk is the Lead RF architect within the DSPS R&D center at Texas instruments. He is a developer of the systems specification and the lead designer for TI’s MBOA UWB RFIC. Prior to this he was a Distinguished Member of Technical Staff in the Wireless Research Laboratory at Bell Labs Basic Research where he developed radio architectures, RF circuit solutions, integrated RF components and modeling algorithms. Nathan received his BS from the University of Minnesota and his PhD from MIT. Mr. Sandeep Kumar is co-Founder, President and CEO of Adimos Inc a fabless semiconductor startup developing and marketing innovative wireless multimedia home networking solutions. He has helped build a company that has achieved significant business successes in its very 1st year and raise 16M$ of capital. Mr. Kumar holds an MSEE from University of Cincinnati & a BSEE from IIT Delhi, India. |
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| 12:00-1:30 | Lunch |
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| 1:30-5:00 | Afternoon Tutorial |
Chair: Christos Kozyrakis |
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Performance Comparison of State-of-the-Art Volatile and Non-Volatile Memory Devices Speakers: J. Thomas Pawlowski (Micron Technology) |
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Between vendor vested interests, presentation hype and datasheet specsmanship, it is often difficult to determine which memory devices are truly the most appropriate for an application in question. This is true for both volatile (DRAM, SRAM and pseudo-SRAM) and non-volatile (NOR and NAND FLASH) memory devices. This 3 hour tutorial will objectively examine the memories available today and in the reasonably near future, including SRAMs such as QDR II, DDR II and QDR III; DRAMs such as DDR2, GDDR3, FCRAM, RLDRAM and XDR, low-power volatile memory devices such as LPDRAM and PSRAM, and low-power non-volatile memory devices such as NOR and NAND FLASH. A brief description will be made concerning external operation of the major devices and where necessary some description of internal operation. The devices will be compared by performance (usable bandwidth under various operating scenarios, energy usage under these scenarios and signal count). Example operating scenarios include random operations, streaming requests with defined read/write ratios and resource predictability, streaming requests with defined read/write ratios but no predictable resource availability, etc. Performance comparisons are made using a cycle-accurate memory comparison software tool written by the author and empirically verified. Cost factors will be considered, including silicon area and test cost of competing architectures. A brief attempt will be made to assess market size and dynamics of the major devices where possible. Conclusions will be drawn for each major operating scenario concerning performance/cost ratios. Wherever possible, practical application examples will be illustrated to make the operating scenarios relevant to the system design tasks faced today and in the reasonably near future. Bio: As Senior Director of Architecture Development in Micron's NetCom group, Thomas Pawlowski is responsible for Micron memory product definition for networking and communications applications. During his tenure at Micron, Tom has created or co-created the following devices: Reduced Latency DRAM-II, Pipelined Burst Synchronous SRAM, Zero Bus Turnaround SRAM, Double Data Rate SRAM and Quad Data Rate SRAM. Tom holds over 80 U.S. and international patents, with more pending. Prior to joining Micron in 1992, Tom's spent eight years at Allied Signal Aerospace. He holds a bachelor of applied science degree in electrical engineering from the University of Waterloo, Ontario, Canada. |
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| 5:00-6:00 | Wine and Cheese Reception |
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| Monday, August 23rd | Goto Top | |
| 9:00 |
Opening RemarksGeneral Chair: Robert Lashley (Sun)Co-Chairs: Bill Dally (Stanford University), Keith Diefendorff (Apple) |
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| 9:10-10:40 |
Session 1: Mobile ProcessingChair: Norm Jouppi (HP) |
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| 10:40-11:00 |
Break |
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| 11:00-12:00 |
Keynote 1Robert Denise (JPL) |
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| Mars Exploration Rovers -- a View from the Inside | ||
| 12:00-1:00 |
Session 2: Wireless CommunicationChair: Mitsuo Saito (Toshiba) |
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| 1:00-2:00 | Lunch |
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| 2:00-3:00 |
Session 3: Media and Graphics ProcessingChair: John Nickolls (NVIDIA) |
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| 3:00-3:30 |
Break |
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| 3:30-4:30 |
Session 4: Enabling TechnologyChair: John Sell (AMD) |
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| 4:30-5:30 |
Session 5: System ComponentsChair: John Sell (AMD) |
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| 5:30-6:45 |
Dinner |
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| 6:45-8:45 |
Panel Discussion: Outsourcing Engineering Development Offshore |
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Moderator: John Nickolls, NVIDIA Panelists: T.J. Rodgers (Cypress Semiconductor), Vinod Dham (NewPath Ventures), Natasha Humphries (TechsUnite), Ron Hira (IEEE-USA, Rochester Inst. Technology), Carl Everett (Accel Partners), Pratul Shroff (eInfoChips) |
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| Many technology companies are outsourcing engineering development to offshore locations, including India, China, and Russia. The panel will discuss their experience, data, and opinions on outsourcing engineering and debate its benefits, problems, and issues. | ||
| Tuesday, August 24th | Goto Top | |
| 8:40-10:10 |
Session 6: PotpourriChair: Christos Kozyrakis (Stanford University) |
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| 10:10-10:30 |
Break |
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| 10:30-11:30 |
Keynote 2:Steve Jurvetson (Draper Fisher Jurvetson) |
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| Nanotech and the Future of Moore's Law | ||
| 11:30-12:30 |
Session 7: Embedded SystemsChair: Tom Petersen (MIPS Technologies) |
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| 12:30-1:30 |
Lunch |
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| 1:30-2:30 |
Session 8: Low-Power ProcessorsChair: Forest Baskett (NEA) |
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| 2:30-2:50 |
Break |
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| 2:50-4:20 |
Session 9: Instruction Set AutomationChair: Chris Rowen (Tensilica) |
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| 4:20-4:50 |
Break |
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| 4:50-6:20 |
Session 10: High-End ProcessorsChair: Pradeep Dubey (Intel) |
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| 6:20-6:30 |
Closing Remarks |
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| HOT CHIPS 16 Conference Ends | ||



