Important Dates
March 25, 2006Deadline for submissions
April 30, 2006Notification of acceptance
July 20, 2006Deadline for final version

Since it started in 1989, HOT CHIPS has been known as one of the semiconductor industry's leading conferences on high-performance microprocessors and related integrated circuits. The conference is held once a year in August on the Stanford University campus in the center of the world's capital of electronics activity, Silicon Valley. The conference emphasis this year, as in previous years, is on real products and realizable technology. Topics of particular interest include:

  • Microprocessors
  • Chipset Chips
  • Systems-on-Chip
  • Embedded Processors
  • Digital Signal Processors
  • Application-Specific Processors
  • Network/Security Processors
  • Graphics/Multimedia/Game Processors/Display Technology
  • Communication/Networking Chips
  • Wireless LAN/Wireless WAN Chips
  • Novel Chips: Quantum Computing, Nano-structures, Micro-array
  • Low-power Chips/Dynamic Power Management
  • Reconfigurable Chips/Processors
  • Chips Built from FPGAs
  • Reliability and Design for Test
  • Compiler Technology
  • Operating System/Chip Interaction
  • Advanced Semiconductor Process Technology
  • Advanced Packaging Technology
  • Performance Evaluation

Presentation Guidelines

Presentations at HOT CHIPS are in the form of 30-minute talks. Presentation slides will be published in the HOT CHIPS Proceedings. Participants are not required to submit written papers, but a select group will be invited to submit a paper for inclusion in a special issue of the IEEE Micro.

Submission Guidelines

Here are a few guidelines for your submissions:

  • Submissions must consist of a title, extended abstract (two pages maximum), and the presenter's contact information (name, affiliation, job title, address, phone(s), fax, and email)
  • Please indicate whether you have submitted, intend to submit, or have already presented or published a similar or overlapping submission to another conference or journal. Also indicate if you would like the submission to be held confidential; we do our best to maintain confidentiality if requested
  • Submissions should be in plain ASCII text, pasted into the message; do not submit .doc files, .txt files, any attachments or other formats. Submissions containing figures may be submitted in pdf, but plain ASCII text is strongly preferred

Evaluation Criteria

Submissions are evaluated by the Program Committee on the basis of the performance of the device (or devices), degree of innovation, use of advanced technology, potential market significance, and anticipated interest to the audience. Research and software contributions will be evaluated with similar criteria.

Deadline

Please mail your submissions in plain ASCII text (in the message, not as an attachment!) by March 25, 2006 to: submit2006@hotchips.org. Authors will be notified as to acceptance by April 30, 2006.Deadline for final version is July 20, 2006.

For More Information

For questions relating to the program, send email to the program chairs at: program2006@hotchips.org.

For questions relating to the conference operation or organization, send email to info2006@hotchips.org


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