Home
HOT CHIPS in the News
Here is a list of articles related to HOT CHIPS mentioned in the news media.
Sun Fattens Up Niagra for Middleware Play
Date: August 22, 2007
Publication: The Register
Hot Chips -- Sun Microsystems' Niagara processors are growing up. The company this week confirmed that the third-generation Niagara chip code-named "Victoria Falls" will slot into two- and four-socket servers. Read more...
Intel Confirms Details of Tolapai, a SoC Embedded Processor
Date: August 30, 2007
Publication: ars technica
At Hot Chips this past week, Intel released more technical details on its coming system-on-a-chip (SoC) processor called Tolapai. Tolapai is Intel's first attempt at an SoC design since its ill-fated "Timna" project a few years back, and when it's launched, it will be their first x86 processor with an on-die memory controller since the 80386EX in 1994. Tolapai is significant because it will be the x86 ISA's next major step into the embedded space, a space currently owned by the PowerPC, ARM, and MIPS ISAs. Read more...
Tilera Shipping 'Mega-Multicore' Chip
Date: August 20, 2007
Publication: PC Magazine
Startup Tilera announced Monday that the company has begun shipping what you might call a "mega-multicore" chip, the TILE64, one that can scale to hundreds or thousands of cores. Read more...
Startup Tilera Debuts at Hot Chips Event
Date: August 19, 2007
Publication: PC World
The annual Hot Chips forum on semiconductor research, beginning Monday at Stanford University, usually draws industry leaders like IBM, Intel, and AMD, but also new companies with ambitions to take on the big firms.
While Advanced Micro Devices, IBM, and Intel will be discussing their two-core and four-core processors, little Tilera will use the conference to introduce itself and its 64-core processor to the chip industry. Read more...
Sun Advances Work on Novel Chip Interconnect
Date: August 17, 2007
Publication: EETimes
SAN JOSE, Calif. — Sun Microsystems will demonstrate at Hot Chips Tuesday (Aug 21) it has solved one of the key problems of its Proximity technology. The novel chip interconnect someday could enable a new level of ultra-dense, high speed computer and communications systems. Read more...
Stanford Confabs Explore Multi-Core CPUs, Nets
Date: July 30, 2007
Publication: EETimes
SAN JOSE, Calif. — The Hot Chips conference has posted its program that will provide a look inside some of today's leading multi-core processors in August at Stanford University. The companion Hot Interconnects event also has laid out its agenda for exploring research in the on- and off-chip networks tomorrow's processors someday may use. Read more...
19th Hot Chips Conference Meets on 19-21 August at Stanford
Date: July 2007
Publication: IEEE
Hot Chips, a symposium sponsored by the Technical Committee on Microprocessors and Microcomputers of the IEEE Computer Society and the Solid-State Circuits Society, will convene at Stanford University’s Memorial Auditorium on 19-21 August. It is the primary forum for state of the art designs and up-to-the-minute developments in high-performance chips, software, and systems. Read more...
Scope: Hot Chips, handset handwringing, more
Date: July 19, 2007
Publication: EDN
The IEEE Technical Committee on Microprocessors and Microcomputers again hosts the pre-eminent technical forum on high-performance processing ICs at Stanford University (Palo Alto, CA) Aug 19 to 21. Appropriately enough for the times, the conference will include three sessions on multicore architectures, one of which—a keynote—will examine the future of the x86 architecture. Read more...
HOT CHIPS in the News
Sister Conferences
|
Technical Affiliations
 
|