Important Dates
April 3, 2009 Submissions due
April 27, 2009 Acceptance notification
July 1, 2009 Final version due

Since it started in 1989, HOT CHIPS has been known as one of the semiconductor industry's leading conferences on high-performance microprocessors and related integrated circuits. The conference is held once a year in August on the Stanford University campus in the center of the world's capital of electronics activity, Silicon Valley. The conference emphasis this year, as in previous years, is on real products and realizable technology. Topics of particular interest include:

  • Processor Chips
    • - Low Power
    - High Performance
    - Multi-Core, Multi-Processor
    - Embedded
    - Mobile Phone
    - Digital signal
    - Application-specific
    - Network/security
    - Graphics/Multimedia/Game
  • Other Chips
    • - Novel technology: quantum computing, nano-structures, micro-arrays
    - Low-power chips/Dynamic power management
    - Communication/networking
    - Systems-on-chip
    - Chipset
    - Wireless LAN/Wireless WAN
    - Chips built from FPGAs
    - Display technology
  • Advanced semiconductor process technology
  • Advanced packaging technology
  • Reliability and design for test
  • Compiler technology
  • Operating system/chip interaction
  • Performance evaluation

Presentation Guidelines

Presentations at HOT CHIPS are in the form of 30-minute talks using PowerPoint or PDF. Presentation slides will be published in the HOT CHIPS Proceedings. Participants are not required to submit written papers, but a select group will be invited to submit a paper for inclusion in a special issue of IEEE Micro.

Submission Guidelines

Submissions must consist of a title, extended abstract (two pages maximum), and the presenter's contact information (name, affiliation, job title, address, phone(s), fax, and email). Please indicate whether you have submitted, intend to submit, or have already presented or published a similar or overlapping submission to another conference or journal. Also indicate if you would like the submission to be held confidential.

Submissions should be in plain ASCII text. Submissions containing figures may be submitted in PDF, but plain ASCII text is strongly preferred.

Please enter your submissions at:
https://www.softconf.com/a/hotchips21/ by April 3, 2009.

Authors will be notified of their acceptance by April 27, 2009.
Send questions relating to the program to the program chairs at: program2009@hotchips.org , and questions relating to conference operation or organization to the general chair, Keith Diefendorff , at: info2009@hotchips.org

Evaluation Criteria

Submissions are evaluated by the Program Committee on the basis of performanceof the device(s), degree of innovation, use of advanced technology, potential market significance, and anticipated interest to the audience. Research and software contributions will be evaluated with similar criteria

For More Information

For more information, download the Call for Contributions in pdf format.

Sponsored by the Technical Committee on Microprocessors and Microcomputers of the IEEE Solid State Circuit Society.

Program Committee Co-Chairs:
Krste Asanovic, UC Berkeley
Ralph Wittig, Xilinx

Check the HOT CHIPS 21 web page for updates:
http://www.hotchips.org


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