Hot Chips 30 (2018) will be held in Silicon Valley, CA in late August 2018 (exact date TBD).
Submission details below or here (pdf).
- Submission Date: March 23, 2018
- Acceptance Notification: May 1, 2018
- Final Version Due: July 16, 2018
- Submissions Due: July 3, 2018
- Acceptance Notification: TBD
Areas of Interest:
- General-Purpose Processor Chips
- High Performance and Low Power
- Multi-Core, Highly-Reliable Systems
- Mobile and Embedded Devices
- SoC, Security, and DSP Chips
- Communications and Networking
- Wireless LAN/WAN/PAN
- Network and IO Processors
- Emerging Computation Architectures
- Machine Learning, Vision and Graphics/Compute Engines
- Data Analytics and Big Data processing
- IoT and Always-On Functions
- Neuromorphic and Quantum Computing
- Other Chips
- FPGAs and FPGA-Based Systems
- Custom Chips for Emerging Applications
- Open-Source Chips
- Other Technologies
- Power and Thermal Management
- Packaging and Testing
- Display Technologies
- On-Chip Optics & Sensors
- Novel Computing Technologies
- Memory Technologies
- Persistent Memory, Phase Change
- Packaging, 3D, Stacked
- Software for Multi-core, Heterogeneous Systems
- Programming models, Runtime systems
- Performance, Power Debug and Evaluation
Submissions must consist of the following:
- “Presentation” or “Poster”
- Extended abstract (two pages maximum)
- Presenter’s contact information (name, affiliation, job title, address, phone(s), fax, and email)
- Indication whether you have submitted, intend to submit, or have already presented or published a similar or overlapping submission to another conference or journal.
- Indication if you would like the submission to be held confidential.
Regular presentation and poster submissions are evaluated by the Program Committee on the basis of: performance of the device(s), degree of innovation, use of advanced technology, potential market significance and anticipated interest to the audience. Both regular presentation slides and posters are published in the Hot Chips proceedings.
Presentations at HOT CHIPS are in the form of 30 minute talks using PowerPoint or PDF. Presentation slides will be published in the HOT CHIPS Proceedings. Participants are not required to submit written papers, but a select group will be invited to submit a paper for inclusion in a special issue of IEEE Micro.
Poster submissions are also accepted from both industry and academia and consist of 4 slides with a one- page summary. In particular, student posters describing applied research performed at a university are encouraged. The most outstanding student poster will receive the Best Student Poster Award.
Program related questions/comments?
Please email our Program Committee Co-Chairs at firstname.lastname@example.org:
- Fred Weber
- Mike Taylor, UC San Diego