Call for Contributions

Hot Chips 27 will be held at the Flint Center in Cupertino, CA on Sunday, August 23, 2015 – Tuesday, August, 25, 2015 (Tutorials on Sunday).

Submit Here! Please read below for submission details.

Important Dates

Submission Due Acceptance Notification Final Version Due
Presentations March 31, 2015 May 1, 2015 July 15, 2015
Posters July 1, 2015 July 21, 2015 NA

Areas of Interest

  • General Purpose Processor Chips
    • High-Performance and Low-Power
    • Multi-Core and Highly-Reliable Systems
  • Mobile and Embedded Devices
    • Graphics/Multimedia/Game
    • SoC, Security, and DSP chips
  • Communications and Networking
    • Wireless LAN/WAN/PAN
    • Network and IO Processors
  • Other Chips
    • FPGAs and FPGA-Based Systems
    • Memory Technologies and Chipsets
    • Custom Chips for Emerging applications
  • Software for multi-Core and Heterogeneous Systems
    • Programming models, Runtime Systems
    • Compilers and Operating Systems
    • Performance, Power Debug and Evaluation
  • High Integrity Computation
    • Secure architectures
    • Design for validation and test
  • Other Technologies
    • Power and Thermal Management
    • Packaging and Testing
    • Display Technologies
    • On-Chip Optics & Sensors
    • Novel Computing Technologies

Submission Guidelines

Submissions must consist of the following and can be submitted here:

  • “Presentation” or “Poster”
  • Title
  • Extended abstract (two pages maximum)
  • Presenter’s contact information (name, affiliation, job title, address, phone(s), fax, and email)
  • Indication whether you have submitted, intend to submit, or have already presented or published a similar or overlapping submission to another conference or journal.
  • Indication if you would like the submission to be held confidential.

Evaluation Criteria

Submissions are evaluated by the Program Committee on the basis of performance of the device(s), degree of innovation, use of advanced technology, potential market significance, and anticipated interest to the audience. Research and software contributions will be evaluated with similar criteria. To the extent that you are describing a product, please indicate its status – design, development, tape out, silicon, shipping, etc.

Presentation Guidelines

Presentations at HOT CHIPS are in the form of 30 minute talks using PowerPoint or PDF. Presentation slides will be published in the HOT CHIPS Proceedings. Participants are not required to submit written papers, but a select group will be invited to submit a paper for inclusion in a special issue of IEEE Micro.

Poster Guidelines

Poster submissions consist of 4 slides and a one-page summary.

Program related questions/comments?

Please email our Program Committee Co-Chairs at  program@hotchips.org:

  • Behnam Robatmili, Qualcomm
  • Rajeevan Amirtharajah, UC Davis